Sales jump 35 Percent

AMSL gears up for $1,000 Billion Chip Market.

23. Juli 2021, 9:16 Uhr | Heinz Arnold
Peter Wennink, CEO of ASML: "By the end of this decade, chip sales are likely to double from $500 billion to $1,000 billion. We need to prepare today to create the manufacturing capacity for that."
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ASML expects revenue to jump 35 percent in 2021 - and looks forward to a decade of continued growth.

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In the second quarter, ASML posted sales of $4 billion (first quarter: $4.364). ASML sold a total of 69 (73) units. However, the decline cannot dampen CEO Peter Wennink's euphoric outlook: "The decline in sales compared to the first quarter is due to the fact that some machines have been shipped that have not yet passed the Factory Acceptance Test and therefore could not yet be included in the sales for the second quarter. They will then be accounted for in the third quarter, when they will account for about $300 million. For the third quarter, ASML expects revenue to be between $5.2 billion and $5.4 billion.

The highest order intake in the company's history

But what is much more interesting, he said, is to look at order intake.
It reached a record $8.3 billion in the second quarter, of which EUV systems alone accounted for $4.9 billion. This brings the total backlog for this year to a value of $17.5 billion. Demand remains high across all market segments, according to Peter Wennink. That applies not only to the most advanced process technologies, he said, but also to mature and older processes - for both logic and memory IC manufacturing.

Demand will remain high through the end of the decade

Demand will remain high over the coming years, initially due to the effects of the Corona crisis and its impact on the supply chain. The resulting catch-up effects will continue into next year.

However, demand will also increase for fundamental reasons: both for machines that manufacture ICs based on the latest process nodes and for systems that are designed for mature processes. The latest processes, for example, require the chips for AI and high-performance computing. "Our capacity in 2022 will be 55 EUV systems, 80 percent of which are already booked by the end of the second quarter," Wennink enthuses. But devices at the edge also require computing power for the many sensors - the ICs needed for this are manufactured in mature processes, but demand for them is also rising sharply, he said. "That's a trend that's not going to go away anytime soon and will continue through this decade," Wennink says. And then, he said, there is a third trend: technological sovereignty. That means major regions like the U.S. and Europe will invest in semiconductor manufacturing. These trends explained ASML's order backlog for this year - and the strong share of EUV systems in it.

Wennink said sales of machines for manufacturing logic ICs will grow 35 percent this year, and sales of machines for memory ICs will grow as much as 60 percent - to $4.7 billion. "Of that, EUV systems account for $1 billion. That's interesting because EUV machines will not yet contribute to capacity expansion this year measured in bits. That capacity will be felt in the market in 2022 and 2023," Wennink says.

Capacity expansion for a $1,000 billion chip industry

That's why ASML plans to expand capacity significantly, by a double-digit percentage amount for DUV systems alone. ASML will increase capacity for building EUV systems to more than 60 units in 2023. "By the end of this decade, chip sales will likely double from $500 billion to $1,000 billion. We need to prepare today to create the manufacturing capacity for that," Wennink explains.

Second quarter highlights

In the second quarter, ASML had sold its first "TWINSCAN NXE:3600D" EUV system, which improves productivity by 15 to 20 percent over the "TWINSCAN NXE:3400C," and overlay improves by 30 percent. ASML is now ramping up production of EUV systems used in memory IC manufacturing. ASML is working with three customers to implement the EUV systems in DRAM production based on future process technologies.

As a highlight in the second quarter, ASML mentions that the "TWINSCAN NXT:2000i" deep UV system exposed 6300 wafers in one day at one customer - a new record for throughput.

The company shows that ASML takes the circular economy seriously by the fact that the hundredth "TWINSCAN" was overhauled in the second quarter. This year, ASML plans to deliver 20 refurbished "PAS" systems, originally launched 30 years ago, and 6 "TWINSCAN" systems.   

ASML also delivered the first "YieldStar 1385", which is able to measure the resulting structures after each etching step, enabling users to increase yield. The new type improves productivity by 50 percent over its predecessor, the "YieldStar 1375."


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