MOST Physical Layer

Glass Fiber Connectivity for Automotive Networks

24. Juli 2013, 17:31 Uhr | Andreas Engel and Markus Dittmann
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Concept discussion: Expanded beam versus physical contact

Figure 4. Simulated effect of randomly distributed dust particles on the optical transmission surface of 50 and 85 µm fiber cores and 200 µm expanded beam lens surface.
Figure 4. Simulated effect of randomly distributed dust particles on the optical transmission surface of 50 and 85 µm fiber cores and 200 µm expanded beam lens surface.
© TE Connectivity

In order to estimate (Table 1) the dust attenuation risk, randomly distributed particles of 20 µm diameter are assumed. Simulation of attenuation due to dust particles shows that the number of losses above 1 dB drops to zero for a beam diameter of 200 µm. Whereas for 50 µm or 85 µm beam diameter, losses higher than 2 dB and up to 4 dB occur within the same random dust distribution (Figure 4). This shows clearly the reduced probability of dust-induced exceptional attenuation (Figure 5).

Figure 5. Distribution on the optical transmission surface of 50 and 85 micrometer fiber cores and 200 micrometer beam lens: With the 200 micrometer expanded beam version the dust impact risk can be minimized.
Figure 5. Distribution on the optical transmission surface of 50 and 85 micrometer fiber cores and 200 micrometer beam lens: With the 200 micrometer expanded beam version the dust impact risk can be minimized.
© TE Connectivity

The attenuation resulting from the simulation shows very clearly that with the 200 µm expanded beam version the dust impact risk can significantly be minimized. With the standard 50 µm fiber much higher worst case impact to the link budget has to expected.


  1. Glass Fiber Connectivity for Automotive Networks
  2. High data rates are possible
  3. Glass fiber and cable concept for automotive application
  4. Connector proposal
  5. The fiber and cable termination process proposal
  6. Concept discussion: Expanded beam versus physical contact
  7. Recommendations
  8. The authors

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