Next generation insulated Packaging Technology

The reliable assembly of traditional power components is often complex and time-consuming. Customers must manually insulate devices using foil or mica-sheets to achieve electrical insulation from the heat sink.

Ansas Semiconductor is solving this challenge with its innovative DCB Insulated Package Technology! ANSAS technology integrates the electrical insulation directly into the device using internal ceramic Al₂O₃ or AlN. This structure ensures total insulation from the heat sink and is maximizing the heat transfer by providing up to 7x increase in thermal conductivity compared to traditional industrial packages like TO-247 using foil.

Hall 6, Booth 160

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