Adressing high-volume production
Vector Photonics develops scalable packaging for PCSEL lasers
Vector Photonics has launched a development programme to improve the packaging of photonic crystal surface emitting lasers (PCSELs).
The Accelerated Manufacturing for PCSEL Packaging Solutions (AMPPS) project is designed to address manufacturing challenges that have limited wider adoption of the technology, including thermal management, scalability and production efficiency.
The company says the new manufacturing capability will support the production of high-power, high-brightness, large-area surface-emitting laser platforms for data centre applications and integration with silicon photonics.
Focus on thermal management and scalability
According to Vector Photonics, growing demand for optical interconnects driven by AI is increasing pressure on existing laser supply chains. Current technologies face challenges including thermal bottlenecks, manufacturing yield and dependence on a limited range of packaging approaches.
The AMPPS programme is intended to develop packaging architectures that improve thermal performance, reduce material waste and strengthen supply chain resilience. Planned outputs include packaged demonstrators, thermally optimised assembly concepts, manufacturing process documentation and design kits.
Applications from data centres to LiDAR
PCSELs combine high beam quality, low divergence and efficient optical coupling, making them suitable for applications such as optical communications, silicon photonics, free-space optical communications, satellites and LiDAR. The new packaging technology is intended to help integrate PCSELs into practical, high-volume systems.
Presentation at ECOC 2026
Vector Photonics plans to present the technology at the European Conference on Optical Communication (ECOC), which takes place in Málaga, Spain, from 21 to 23 September 2026. The company will exhibit at stand 1468.
