International

Interview with Prof. Leo Lorenz / ECPE

"New Failures keep on popping up"

Ruggedness and reliability are recurring issues in the area of power semiconductors. This has not only to do with the new wide-bandgap materials. Silicon also faces these same issues over and over again. DESIGN&ELEKTRONIK asked Professor Leo Lorenz,…

2D titanium carbides (MXene)

Super talent for energy storage

Like a battery, MXene stores large amounts of electrical energy - but unlike batteries,…

Because of the Coronavirus

Logimat 2020 trade fair cancelled

In view of the accelerated spread of the Coronavirus, the intralogistics and process…

Cologne Chip/GlobalFoundries

FPGAs »Made in Germany«

GateMate from Cologne Chip is a FPGA family with components of small to medium density.…

Voice-Assistant

Devices will process voice locally in the future

The use of voice interfaces to control devices by voice command is expected to increase…

Because of the Coronavirus

Hanover Fair to be postponed

The Hanover Fair is postponed to the week of 13 to 17 July 2020. Deutsche Messe AG is thus…

embedded world 2020

Balance of a memorable event

The 18th »embedded world exhibition&conference« already came under pressure in the run-up…

FPGAs Conquer Industrial Applications

Edge computing for AI requires performance and flexibility

With Industry 4.0, data volumes and the requirements placed on data transmission and…

Personal Computing Devices

COVID19 Puts Computer Market under Pressure

Due to the COVID19 outbreak, IDC expects sales of personal computing devices (PCDs) to…

Open Source Hardware – RISC-V

We will have 62.4 billion RISC-V CPU cores running by 2025

With more than 500 RISC-V Foundation members in 28 countries around the world, RISC-V is…