International

X-Fab and X-Celeprint

3D ICs from the Foundry

X-Fab now offers the possibility to combine different semiconductor technologies in one chip via Micro-Transfer-Printing and to manufacture them in high volumes.

Alliance with Chipbond

UMC invests in Advanced Packaging

UMC has formed a strategic alliance with Chipbond Technology to gain a foothold in...

Intel

German Location Candidates for Fabs

Intel plans to announce by the end of the year where eight large chip fabs will be...

Preventing Pandemics

Animal Observation from Space Makes It Possible

In the "Icarus" research project, entire animal species can be observed worldwide - and...

Zone control units

Valeo and Leoni join forces

Valeo and Leoni aim to jointly launch an industry-leading solution for zone control...

Focus on Many New Markets

Polestar Presents Global Expansion Plans

At the IAA Mobility trade show in Munich, the Swedish electric carmaker announced its...

Artificial intelligence at elections

More opportunities than threats

We encounter AI in all areas of life - including democratic elections. AI-controlled...

VR Entertainment in the Audi

Holoride on the Way to Series Production

Virtual worlds will soon be available in the Audi: In the near future, you will be able...

Marketable Sodium-Ion Battery

Dawning of the Post-Lithium Age

Up until now, lithium-ion batteries have been inextricably linked to electromobility....

Detailed Lifecycle Analysis

Polestar Cars: This is how much CO2 they Produce

Polestar no longer wants to keep secrets about the climate impact of its latest...