At embedded world, hema electronic will present the new Fastlane board service for its embedded vision platform. Developers can get a working prototype of their electronics in 30 days. In addition, hema will show a TSN-over-Ethernet demo with Kria-SoM and IP cores from SoC-e.
Hema's TSN-over-Ethernet demo is also based on the modular design platform for custom electronics, which reduces time and cost in development and minimizes design risk. Other demos at booth 444 in Hall 2 show how developers can additionally benefit from a comprehensive framework of developer tools and software.
For the Fastlane board service, hema electronic has optimized its production processes from layout and design to purchasing, warehousing, flexible assembly and logistics. As a result, near-series prototypes for embedded vision electronics are created within a few days. For this purpose, customers select function and interfaces in a workshop or by means of a configurator and define the board format. For variable computing power, one or more System-on-Module, for example from the AMD Kria series, can be integrated.
Circuit diagram and layout are created based on the proven hema Design Library with over 45 predefined Building Blocks. New and customized circuits can also be considered. The prototype will be delivered including a board support package with FPGA middleware, tools and demo applications.
Also to exhibit at the show is a TSN over Ethernet demo. It is based on hema electronic's embedded vision platform, with AMD's Kria system-on-modules and a dedicated TSN IP core from SoC-e. This allows companies to quickly and easily develop Ethernet front-end devices with native support for Time Sensitive Networking. The technology enables Ethernet infrastructure to be shared between IT and OT applications, including real-time requirements. The result is flexibility and scalability of the network infrastructure. At the same time, the effort for cabling and maintenance is reduced. Mobile applications in particular benefit from a significant reduction in cable weight in addition to cost savings.