Digital-Micro-Switch Technology Now Available

Corning’s Through Glass Via Packaging Technology

In addition to a significant size reduction, Corning’s TGV technology brings major performance benefits to Menlo’s DMS products. By eliminating wire bonds and replacing them with short, well-controlled metallized vias, package parasitics are reduced by more than 75 percent. This allows support for increasingly higher frequencies, which are becoming more and more important in advanced wireless communications systems, test instrumentation, and numerous aerospace and defense applications. Additionally, the unique properties of glass versus legacy substrate materials like silicon enable lower RF losses and higher linearity, which translates into lower power consumption and higher overall efficiency.

1. Digital-Micro-Switch Technology Now Available
2. Shrinking product size and reducing manufacturing steps
3. Corning’s Through Glass Via Packaging Technology