Infineon
CoolSiC half-bridge in H-DPAK
Build your next OBC converters and AI data center PSUs with half the external components with Infineon’s new CoolSiC HB in H-DPAK.
This single package solution has the optimal power path that eliminates stray inductance that plagues discrete designs and unlocks the full potential of SiC's extreme switching speeds for half-bridge and bidirectional topologies.
The new integrated SiC solutions have superior thermal management thanks to top-side cooling, and precise controllability that eliminates 2/3rd of the parasitics. This empowers designers to achieve maximum efficiency and power density immediately, bypassing the complex implementation challenges and reliability risks associated with discrete builds, all within the same dimensions as before.
Combining two SiC devices in a compact, thermally efficient package with a split-lead frame and optimized drain pads, enhances heat spreading to ensure clearance compliance in dense, high-power designs.
Hall 7, Booth 470
