Yangtze Memory Technology

China to Supply 64- Layer Flash Memory from as of 2019

16. August 2018, 10:50 Uhr | Heinz Arnold
Mit der neuen Xtacking-Technik will Yangtze Memory Technology (YMTC) den Vorsprung der weltweit führenden NAND-Flash-Hersteller aufholen
With the new Xtacking technology, Yangtze Memory Technology (YMTC) aims to catch up with the world's leading NAND flash manufacturers.
© Yangtze Memory Technology

Yangtze Memory Technology will present the Xtacking process at the Flash Memory Summit, which is currently taking place in Silicon Valley.

The core of the technology: The memory array and the logic part, which is responsible for the I/O connections, are produced on two different wafers. The two wafers are then placed one on top of the other and connected via VIAs. With this technology, Simon Yang says NAND memory could achieve data transfer rates of 3.0 Gbps, similar to DDR4 DRAMs. The development time would be reduced by 3 months due to the separate production of memory array and logic part and the introduction of new products on the market would be significantly accelerated. In addition, it was relatively easy to implement customer-specific modifications.

Currently, six companies share the world market: According to DRAMeXchange, Samsung leads with 37 percent, followed by Toshiba Memory with 19.3 percent, and Western Digital with 15 percent.  Micron ranks fourth with 11.4 percent, SK Hynix has 9.8 percent, and Intel 6 percent. The rest of all manufacturers have a combined share of only 0.8 percent.

Yangtze Memory Technology was founded in 2016 and currently employs over 3000 people. A factory is being built in Wuhan, and 24 billion dollars are to be invested in its construction. By the end of the year, Yangtse Memory Technology plans to start manufacturing 32-layer NAND flash ICs. However, the market has been tilting since the beginning of the year: Supply exceeds demand, so prices have already fallen significantly by 20 to 30 percent. Analysts predict further price declines for the coming year.

However, the market situation may be less interesting for Yangtze Memory Technology;, the company's main objective is to gain market share. This presupposes that the company can really produce the 3D NAND chips with 32 and then 64 layers in high volumes and high quality. Whether the analysts who assume that this could hardly succeed in the planned time will be provend right?



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SAMSUNG Semiconductor Europe GmbH, Dynabook Europe GmbH, MICRON SEMICONDUCTOR (Deutschland) GmbH