embedded-world-Neuheiten: Embedded Computing

16. März 2023, 32 Bilder
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© Texim Europe

Multi-Band 5G M.2 Module

Texim Europe provides the “SIM8202E-M2” communication module from SIMCom Wireless Solutions. The M.2 module in 3042-S3-B formfactor is a Multi-Band 5G NR/LTE-FDD/LTE-TDD/HSPA+ module which supports up to 2.4 Gbps data transfer with 5G Sub-6. The module provides great flexibility with versatile cellular connections like Sub-6 and LTE, GNSS support like GPS and Galileo, and ease of integration due to the extensive interface options including PCI-Express, USB 3.1 and GPIO. Thanks to the interface options and high throughput for data the SIM8202E-M2 is ideal for many professional applications that require a high performance, flexible and secure communication module. Drivers are available for a wide variety of operating systems such as Microsoft Windows, Linux and Android for a quick system integration.