COM-HPC Mini
Working group reaches key milestone
The PICMG standardization group working on embedded standards, has defined the pinout and dimensions for the COM-HPC Mini form factor. With this, the working group for COM-HPC Mini has reached an important milestone.
With this, the vast majority of COM-HPC mini-standard details have already been defined and work has begun on creating the documentation. Reaching the milestone will allow PICMG members to start developing compliant modules. Thus, developers will have access to an elaborated ecosystem shortly after the specification is introduced. There are 15 PICMG member companies participating in the COM-HPC Mini working group. This reflects the high market relevance and demand for a credit card-sized Computer-on-Modules standard. Only 12 weeks passed between the approved »Statement of Work« and the final definition of mechanics and pinout by the working group.
Christian Eder, chairman of the COM-HPC technical committee and director of product marketing at congatec, is »confident of a release candidate for the PICMG release process in the first quarter of 2023 and a published specification in the second quarter of 2023.« He said he expects the first product announcements to be closely tied to the release date.
Details of COM-HPC Mini
The pinout specification for COM-HPC Mini defines the use of one connector instead of the two implemented for COM-HPC client and server modules (sizes A to E). Just as is the case for COM Express Mini compared to COM Express Type 6. However, with COM-HPC, half the number of signal pins still means 400 signal lanes - 90 percent of the capacity of COM Express Type 6 modules.
COM-HPC Mini offers a 50 percent smaller footprint compared to COM-HPC client-size A modules, the smallest COM-HPC form factor currently available. The small, 60 mm x 95 mm modules are needed for high-end embedded computer logic in devices such as DIN-rail PCs for electrical racks in building and industrial automation or portable test and measurement equipment. In addition, the new specification is expected to enable engineers to integrate advanced interfaces such as PCIe Gen4 and Gen5 into small processing units. For more information on COM-HPC, visit the PICMG homepage, where you can also purchase the specification for $750.
