Trade fair duo Motek/Bondexpo
Two trade fairs at one go
The Motek trade fair will take place for the 41st time next week, flanked by Bondexpo, which will open its doors for the 16th time. Together, the two trade fairs will occupy three halls of the Stuttgart Exhibition Centre this time, namely Halls 3, 5 and 7.
From 10 to 13 October 2023, the assembly and handling technology sector will meet in Stuttgart for Motek as the "International Trade Fair for Production and Assembly Automation", together with Bondexpo as the "International Trade Fair for Adhesive Bonding Technology". The trade fair duo focuses on production as a complete system and shows future-oriented solutions - from components and assemblies as well as subsystems to complete systems.
Four full days of Motek/Bondexpo are on the trade fair calendar of the automation industry every autumn. Suppliers and users will meet face-to-face from 10 to 13 October in Halls 3, 5 and 7 of Messe Stuttgart to discuss how to meet current and future challenges: international crises, climate change, the energy transition, rising costs, the shortage of skilled workers - companies must respond fundamentally to these complex tasks in order to survive in the market. The demand for resource conservation and sustainability in industrial manufacturing takes on a special significance and is also a topic at Motek/Bondexpo. The trade fair duo deals with the complete process chain for economic production - from components and assemblies as well as subsystems to complete systems - and considers industrial manufacturing as an overall system.
Solutions for easy entry into automation
One of the priority topics of the exhibitors is the easy entry into automation, whose role in the value chain of industrial manufacturing processes is constantly growing. Automation and the use of digital technologies are the basis for energy-efficient and resource-saving processes. There are three key areas on the trade fair schedule: Smart and networked products for feeding, handling and assembly, for example grippers, handling systems, intelligent screwdriving technology, smart linear technology, smart drives and feeding components; assembly assistance systems for manual and semi-automatic workstations, assisted picking, ergonomic and age-friendly workstations, automated bin picking, co-working with cobots and automated part provisioning or part removal; solutions for easy implementability and commissioning, this includes software, plug-and-play solutions, starter kits and simulations through the digital twin.
Fully integrated Bondexpo shows bonding technology as a key technology
For years, bonding technology has played a growing role in product manufacturing. It is the only joining technology that connects almost all material combinations with each other in a long-lasting and secure manner, without impairing their respective unique properties. Adhesive bonding technology allows additional functions such as thermal conductivity or protection to be added, which increases the product service life. Only with the help of adhesive bonding technology are both lightweight construction and miniaturisation possible, each of which contributes to energy and resource efficiency. Furthermore, bonding is an indispensable repair process and therefore valuable in terms of product life and sustainability.
Technical lectures at the exhibitor forum
Motek/Bondexpo invites interested trade fair visitors to attend the technical lectures at the Exhibitor Forum. Guests benefit from the latest know-how transfer and networking on all days of the fair: www.motek-messe.de/messeprogramm.
Opening hours of Motek/Bondexpo
The opening hours of Motek/Bondexpo at Messepiazza 1 in 70629 Stuttgart are as follows: Tuesday, Wednesday, Thursday from 09.00 to 17.00, Friday from 09.00 to 16.00.
