International

Winbond/UCIe Consortium

Chiplet Standards for 2.5/3D-DRAMs

Winbond has joined the UCIe Consortium, which defines interconnects between chiplets within a package for advanced 2.5D/3D devices.

Amkor Technology/GlobalFoundries

At-scale Semiconductor Test and Assembly Services in Europe

Amkor Technology and GlobalFoundries announced that the two companies have formed a...

Omdia: For the first time

Flat panel display manufacturing capacity decreases

Capacity used to manufacture OLED and LCD panels will decline in 2023 for the first...

SiTime

Faster GPS Signal Acquisition and Locking

Devices that use GPS signals can acquire and lock to GPS more quickly and securely with...

Siemens/Swinburne University

Accelerate energy transition and net zero

Siemens and Swinburne University of Technology have agreed to set up the most advanced...

Infineon Technologies

Dividend of €0.32 per share approved

Infineon Technologies has finished its 23rd Annual General Meeting. The entire event...

Processing Data

Seco integrates Clea platform into Google Cloud

At embedded world in Nuremberg, Seco presents its extensive product portfolio. Among...

hema at embedded world

In 30 days to an embedded vision prototype

At embedded world, hema electronic will present the new Fastlane board service for its...

Automated Valet Parking

BMW and Valeo develop Level-4 parking systems

BMW and Valeo have entered into a strategic cooperation focusing on the development of...

iPronics

First Shipments of Reprogrammable Light-Processors

iPronics has delivered initial shipments of its SmartLight Processor, which uses up to...