International

New joint venture

VIS and NXP plan to build and operate a 300mm fab

The specialty IC foundry service provider VIS and the semiconductor manufacturer NXP plan to establish a joint venture for building and operating a new 300mm fab in Singapore. The cost of the initial build is anticipated to be $7.8 billion. The fab will be operated by VIS.

SiPearl

Christophe Ménard is the new Chief Commercial Officer

SiPearl, the company building the high-performance low-power European microprocessor...

IC-Haus

Technological step forward for optical encoder

The iC-PXL3212 from iC-Haus is an optical, reflective, lensless encoder IC with...

Advantest

Ultra-High-Current Power Supply for SoC Test System

Advantest launches the DC Scale XHC32 power supply for the V93000 EXA Scale SoC test...

Strategic partnership

Edmund Optics and Quartus Engineering cooperate

Edmund Optics and Quartus Engineering announce a new strategic partnership to offer...

Vitesco Technologies/Honda

Electric drive system for Fuel Cell Electric Vehicle

Vitesco Technologies will deliver its EMR3 (Electronics Motor Reducer, 3rd Generation)...

Imec/Sarcura

Scalable on-chip detection of human white blood cells

Imec and Sarcura present their proof-of-concept on-chip flow cytometer using integrated...

Wireless-charging boards

Industrial, medical, and smart-home applications

STMicroelectronics has introduced a 50W, Qi-compatible transmitter and receiver...

MIMO Needs FinFET

7 Key Changes, Analog Designers Will Need to Make

For analog designers, moving to FinFet technology represents a drastic change. In this...

NFC I2C bridge tag

Contactless authentication and secured configuration for the IoT

The number of IoT devices is rapidly increasing, and they have already become a part of...