International

Texas Instruments

DLP technology for advanced packaging

Texas Instruments is looking to break into a whole new market for its DLP technology: packaging production without the need for expensive masks.

STMicroelectronics

Linear Voltage Regulator Preserve Battery Energy

The L99VR03 from STMicroelectronics supplies control units, telematics systems and head…

Renesas Electronics

Motor Control MCUs

Renesas Electronics introduced the RA8T2 MCU group for high-end motor control. The new…

SiC power electronics packages

Infineon and Rohm collaborate

Infineon and Rohm have signed a Memorandum of Understanding to collaborate on packages for…

Only a few days left

embedded world Conference: Very Last Call for Papers!

If you would like to submit a presentation proposal for the embedded world Conference 2026…

SerDes Chipset

A-PHY has Entered Mass Production in SUV Model by Lynk & Co

The MIPI Alliance, an international organization for interface specifications, has…

Strategic Cooperation for CoMs

Congatec and Aaronn Electronic Collaborate

Congatec, a vendor of embedded and edge computing technology, and Aaronn Electronic, a…

AI Infrastructure and PC

Nvidia invests in Intel; partnering on the development side

Nvidia and announced a collaboration to jointly develop multiple generations of custom…

Quectel Wireless Solutions

New SVP Sales for the EMEA Region

Quectel Wireless Solutions, an end-to-end global IoT solutions provider, is pleased to…

Renesas Electronics

Ultra-Low-Power RA0 MCUs with Capacitive Touch

Renesas Electronics introduced the RA0L1 microcontroller (MCU) Group based on the Arm…