International

Fraunhofer FIT

AI Optimizes Design of PCBs

As applications become more and more diverse and complex, the demands on design and quality assurance of printed circuit boards are increasing. Through modular AI platforms Fraunhofer FIT can reduce the effort by up to 20 percent.

Paul Scherrer Institut (PSI)

New material approach for OLEDs

At the Paul Scherrer Institute PSI researchers have found a promising material for...

Production line for the series

How plastic parts for cars will come out of the 3D printer

The Polyline project brings together 15 industrial and research partners from Germany...

Car study 2020

What moves the drivers in Germany

For the Autostudie 2020, the Forsa survey institute interviewed more than 1000...

AI research in Germany

IBM and the University of Stuttgart cooperate

IBM and the University of Stuttgart have joined forces to advance AI research in...

Wireless Congress 2020

The Conference Takes Place!

Even if the corona pandemic in November 2020 should affect travel and conference...

Communication in the IIoT

Data exchange from IO-Link via JSON and MQTT becomes possible

The IO-Link community has published a specification that describes how data can be...

Contact tracing

Distance Alerts for Enterprises

How to maintain the required minimum distance at the workplace? - A small device helps....

New FPGA architecture

With the most cost-effective FPGAs against the Big Player

German semiconductor manufacturers are quite rare. Now the German company Cologne Chip...

Covid-19 in the United Kingdom

RS Helps with 3D Printing of Protective Visors

Distributor RS is donating PLA filament to produce 20,000 sight frames to support the...