International

ECPE Workshop

Power Modules of the Future

Wide-bandgap semiconductors and electromobility pose completely new challenges for packaging and interconnection technology. For this reason, the European Center for Power Electronics (ECPE) organized a workshop on "Advanced Power Packaging – Power…

GlobalData

Huawei Suffers Little from US Ban

In May 2019, the US export ban against Huawei came into force, and the company's sales…

embedded world Exhibition&Conference

Cypress-CEO Hassane El-Khoury holds Keynote 2020

The Conference-Keynote 2020 "How the IoT Will Drive the Convergence of Man and Machine"…

Tel Aviv Wooing Tech Companies

Welcome, Founder

Google, Salesforce or Amazon are already there - to attract even more international…

Son Takes over as Successor

Hans-Jürgen Hilscher Hands over the Baton

After more than 33 years as Managing Director of the Hilscher Gesellschaft für…

Ford & EOS

Rim Lock from the 3D printer

Ford uses 3D printing to produce custom rim locks.

DB Cargo and Toshiba

Development of Hybrid Locomotives

DB Cargo plans to develop and purchase 100 new hybrid locomotives with Toshiba.

Inkjet Printer from Leibinger

Printing on Cables at over 60 km/h

The marking system Jet Rapid Wire from Leibinger marks cables, wires, pipes and hoses at…

Corona-Virus

Webasto Informs about Employees Infected

Among the employees of the automotive supplier Webasto additional cases of infection with…

ZVEI Trend Barometer – Comment

Sentiment better than numbers

Decision-makers in the electrical industry are surprisingly optimistic. However, the key…