International

Improved Power Density

CoolSiC MOSFETs 650 V G2 in Q-DPAK and TOLL packages

The electronics industry is shifting to compact, powerful systems. Infineon supports this trend with new 650 V CoolSiC MOSFET families in Q-DPAK and TOLL packages, driving innovation at the system level.

Altera: Keynote at embedded world

FPGAs and AI – the perfect combination at the edge

Sandra Rivera, CEO of Altera, is the keynote speaker at this year's embedded world…

For Next-Generation DRAM Devices

Ultra-High-Speed Memory Test System

Advantests ultra-High-Speed DRAM Test System T5801 is engineered to support the latest…

Das Kunststoffzentrum SKZ

Spectroscopy and AI keep an eye on the ageing of plastic

Under the project management of Silicann Systems GmbH, SKZ is launching the SpectralAIge…

Extended debug functions

UDE 2025 enables efficient investigation of runtime errors

The UDE 2025 version of the Universal Debug Engine, presented by PLS for the first time at…

Conferences at embedded world 2025

Comprehensive Program Line-ups

From March 11 to 13, 2025, the embedded world Conference and the electronic displays…

Groundbreaking 80 W laser system

Toptica launches Ultra-Low Noise 532 nm Laser

A team of researchers and engineers at Toptica Photonics AG has achieved a breakthrough,…

Seltech and Syntiant

Global Strategic Collaboration

Seltech and Syntiant have entered into a global strategic collaboration agreement to…

Enhanced Delivery Speed and Reliability 

Edmund Optics Opens New European Distribution Hub

Edmund Optics has opened a new distribution center in Best, Netherlands. This milestone…

GlobalData

Hydrogen economy development enters critical phase

The hydrogen economy grows slower than expected. By 2030, 83% of low-carbon hydrogen will…