International

3D IC integration

Applied Materials joins forces with Besi and EV Group

Applied Materials is joining forces with partners such as Besi and EV Group (EVG) to optimize wafer-to-wafer bonding, an essential process for 3D integration of ICs.

Artificial Intelligence

Sustainable AI Lab at Bonn University launched

AI can be an important tool for sustainable development - for example, by helping to...

Embedded-RTOS

Without Periodic Tick Interrupts

With Cycle-resolution Timing, the embOS-Ultra real-time operating system (RTOS) can...

Software

Managing the Risk of Adopting Third Party Code

Modern embedded software is a complex conglomerate of code components that originate...

Wireless Technology for IoT

Microchip supports IP500

With Microchip, the IP500 Alliance has gained a major semiconductor manufacturer as a...

Hannover Messe 2022: from 25 to 29 April

"Mapping the Greatest Transformation of Industry"

Digitalisation and sustainability - these are the key themes of Hannover Messe 2022,...

Heavy duty electric trucks

BorgWarner supplies the e-drive

A German OEM will use BorgWarner's HVH250 (High Voltage Hairpin) electric motors to...

Connected vehicle services

SAIC Motor uses Here services

Chinese automaker SAIC Motor relies on Here Technologies for the connected infotainment...

New M2M Cooperation for Industry 4.0

Siemens and Merck to Build Transparent Supply Chains

The partnership aims to open up new business models for machine builders through...

Monitoring via Mioty

IoT for critical infrastructures

In a pilot project, the Swiss energy producer and supplier Axpo has automated the...