International

Time-Sensitive Networking

Market Expectations, Capabilities & Certification

This document describes the market requirements and expectations for Wireless TSN that may be supported by Wi-Fi and 5G systems. This document also captures the main assumptions and functionalities required to enable integration and interoperability…

The car of the future

How Germans imagine their dream car

More technical finesse or practical functionality? Germans have clear ideas about the car…

Research project »OCELI«

Tracking bee decease with AI

In the OCELI project, researchers want to use AI to collect reliable data on the causes of…

Secure Cloud Services for Gaia-XX

Structura-X Starts as Lighthouse Project

The fragmentation of the cloud market in Europe is going to end: 28 European digital…

Bosch

Semiconductor Production in Reutlingen will be expanded

In an additional move to combat the ongoing global chip shortage, Bosch plans to further…

Morality for Artificial Intelligence

AI Technology Must Master Ethics

Do what is feasible? AI should benefit companies without harming or disadvantaging people.…

Specification for Box PCs

PICMG develops new standard

A PICMG working group is developing a specification for industrial box PCs called…

Chip Design

Smaller Structures, More Complex Systems – and Supply Bottlenecks

Chip designers and semiconductor manufacturers will continue to face growing challenges in…

Saving freshwater

Microsatellites against water wastage

Researchers from Freiburg want to limit water wastage in agriculture with a swarm of…

Award for IC Designer

CSEM Awards Inventor Prize for the First Time

The first CSEM Inventor Award honors Franz Xaver Pengg for his invention. His two-stage…