PICMG prepares COM-HPC for ratification

After the pinout was presented this year, the COM-HPC standard is to be finally available next year. As the PICMG announces, the qualification is well on its way.

PICMG announces that COM-HPC has entered member review. The member review phase occurs, after the technical subcommittee approves the specification and acts as a final review by all PICMG members in good standing. Reaching this approval step is a milestone in ensuring ratification will be reached in early 2021. The base specification will complement a Platform Management Interface Specification, COM-HPC EEEP, and Carrier Board Design Guide.

In conjunction with the review cycle, PICMG has published a preview specification. The abridged specification is available for public download and distribution.

COM-HPC is the soon-to-be-released PICMG standard for high-performance Computer-on-Modules (CoMs). It defines five module sizes to deliver edge server performance for small, rugged data centers. The new specification will complement COM-Express, which will continue to play a crucial role in the CoM marketplace for many years.

PICMG developed this specification to address emerging requirements in the embedded and edge computing market. Trends, including the substantial data growth and processing requirements of broadband and 5G as well as edge analytic including AI and situational awareness applications. IoT devices, sensors, and actuators are producing tremendous amounts of data that require preprocessing at the edge for improved data processing efficiency and, end to end security. Autonomous vehicles, smart factories as well as smart retail are among many applications that will benefit from increased edge server and edge client class processor modules or CoMs.

For more information about the COM-HPC specification and to access its preview document, visit PICMG's website.