02. März 2021, 14:00 Uhr | Tobias Schlichtmeier
A COM-HPC Carrierboard.
The open specification for high performance compute modules »COM-HPC« is approved by the PICMG Consortium. It is now available for public download and distribution.
COM-HPC defines five module sizes to deliver edge server performance for small, rugged data centers. The specification addresses emerging requirements in the embedded and edge computing market. The base specification will be accompanied later this year by a Platform Management Interface Specification, COM-HPC EEEP, and a Carrier Board Design Guide.
It is important to note that the specification covers two classes of modules. The COM-HPC Client Module Type targets use in high end embedded client products that need one or more displays, a full set of low, medium, and extremely high bandwidth I/O, powerful CPUs, and modest size. Typical uses are in medical equipment, high end instrumentation, industrial equipment, casino gaming equipment, ruggedized field PCs, transportation, and defense systems and much more.
The COM-HPC Server Type targets use in high end headless (no display) embedded servers that require intensive CPU capability, large memory capacity, and lots of high bandwidth I/O including multiple 10Gbps or 25Gbps Ethernet, and up to 65 PCIe lanes, at up to PCIe Gen 5 speeds. Typical uses are in embedded server equipment ruggedized for use in field environments and applications such as autonomous vehicles, cell tower base stations, geophysical field equipment, medical equipment, defense systems and much more. Both client and server modules have a dedicated platform management interface which is the first for a COM standard to include remote administration. This new specification does not replace COM Express, which will continue to play a crucial role in the COM marketplace for many years.
The specification documents are available for download on the PICMG website. Also available is a preview document and additional resources to learn more about the specification.