The OPC Foundation has announced the launch of the globally available UA Cloud Library. The library makes it easy to find, share, explore, and use OPC UA Information Models by applications, end-users, and standards bodies.
The UA Cloud Library was co-developed with the Clean Energy and Smart Manufacturing Innovation Institute (CESMII). With its multi-cloud architecture, the UA Cloud Library saw contributions from all major cloud vendors leveraging open interfaces and is available for sharing, finding, and collaborating on OPC UA Information Models. Today, the UA Cloud Library already contains over 65 OPC UA Information Models created by individual companies as well as international standards organizations like AutoID, DEXPI, MDIS, MTConnect, and over 30 VDMA working groups as part of their OPC UA Companion Specification.
According to the OPC Foundation the UA Cloud Library offers two standout benefits: OPC UA information model access for applications and ease of use of the entire OPC UA Companion Specification collection for end-users in general.
While shop floor (OT) components routinely discover and use data structures and services of other OPC UA components, direct access to such semantic information has not been readily available to cloud-based applications due to security considerations. The UA Cloud Library eliminates this gap by providing IT and cloud-based applications access to semantic information directly from the cloud instead of manually getting it from the OT systems.
"The UA Cloud Library is the missing link that makes OPC UA information models available in the cloud on a global scale without requiring a connection to physical machines," said Erich Barnstedt, Chief Architect Standards & Consortia, Microsoft Corporation, and chair of the UA Cloud Library working group. "It enables OPC UA Information Models – used as blueprints for industrial digital twins - to be looked up and matched against time-series machine telemetry data provided by cloud-based analytics software, which is a common requirement in IIoT projects."