Adlink Technology expands it's product portfolio of COM-HPC computer on modules. The »COM-HPC-cRLS« is based on Intel's 13th generation of Core CPUs and comes with Size C form factor of the COM-HPC standard.
Utilizing Intel’s advanced hybrid architecture, with up to 16 Performance-cores plus 8 Efficient-cores and an increased cache of 36MB, the module demonstrates brilliant performance per watt along with AVX-512 VNNI and Intel UHD AI inferencing support for realizing diverse edge AI and IoT use cases.
Available with up to 13th Gen Intel Core i9 processor at 65 W TDP, the »COM-HPC-cRLS« provides two 2.5 GbE LANs and up to 128 GB DDR5 SODIMM at 4.000 MT/s. Most importantly, it packs a x16 PCIe Gen5 lane that can fulfill the same computing and transmission performance with fewer lanes than its predecessors, and with a bandwidth of up to 32 GT/s, in driving next-gen compute-intensive edge innovations.
What’s more, the module offers Intel TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support. TCC brings precise time synchronization and CPU/IO timeliness within a system, whereas TSN optimizes time precision for synchronized networking between multiple systems. With these two features working coincide with one another, COM-HPC-cRLS can be assured of the timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well fitted for hard real-time computing workloads required by applications such as industrial automation, semiconductor equipment testing, AI robots, autonomous driving, and aviation.
All in all, the Adlink COM-HPC-cRLS cannot only simplify developers’ application-specific carrier designs and reduce their time to market significantly with PCIe Gen5 but also caters to various future-proof edge AI use cases at all fronts. Adlink is also working to provide I-Pi development kits based on the COM-HPC-cRLS module for on-the-spot prototyping and referencing.
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