Semiconductor industry 2020

Meeting the Challenges of the Future with Innovation

11. November 2020, 10:53 Uhr   |  Stefan Bruder

Meeting the Challenges of the Future with Innovation
© Bild: Texas Instuments

Stefan Bruder, President EMEA, Texas Instruments

Trends such as energy efficiency and reliability are only going to increase in the future as a result of increasing requirements with regard to functional safety – Stefan Bruder, President EMEA, Texas Instruments is convinced.

With the growing interest in improving operational and energy efficiency, safety, and security, at Texas Instruments we’re seeing companies continue to focus on advancing industrial and automotive electronics systems. In automotive, this means providing the analog and embedded processing products automakers need to advance vehicle electrification, driver-assistance, security and the in-vehicle experience. In industrial, we continue to see a desire among companies to automate their factories with greater system intelligence and control, more power efficiency and increased levels of functional safety. We are enabling these trends by applying our passion to create a better world by making electronics more affordable through semiconductors.

In both the automotive and industrial sectors, we are committed to helping companies overcome the many challenges we see and to drive innovation forward. Therefore, improving power density and system reliability are key factors in most industrial designs – including medical equipment, aerospace and defense, factory automation and in automotive designs. And we believe these trends will continue. This is especially true for vehicle electrification, which is transforming the automotive industry. From mild hybrid to full electric, 48 V to 800 V and beyond, automakers need to know they can quickly get power management and isolation technology to improve power density, and achieve safety and efficiency requirements. All whilst reducing overall system cost.

System Integration for Electric Vehicle Drives

For example, automakers are currently considering many options to integrate key elements of the electric vehicle powertrain into one combo box system. The most prominent version of this architecture is the integration of the on-board charger and power-conversion systems to drive battery electric vehicles, and plug-in hybrids.

The integration into a single enclosure that shares space with mechanics, the cooling system, the microcontroller and power stage, as well as magnetics, greatly improves the overall power density, efficiency, system reliability and, most importantly system cost. In addition, isolated power management products like TI’s new ISO26262-compliant UCC5870-Q1, integrate the strongest gate drive capabilities and diagnostic features to greatly increase efficiency and system-level power density for high-voltage traction inverters. All whilst fulfilling reliability and up to ASIL-D targeted functional safety requirements with significant design to cost improvements.

As a final example, I would like to look at gallium nitride (GaN). Over the past decade, TI has provided GaN power management products helping design engineers double the amount of power density, while making systems smaller, more efficient and reliable. And we continue to innovate new GaN power products to push the power density boundary even further.

In automotive, GaN-based power systems will help make electronics in vehicle electrification smaller, while reducing weight and cost in the vehicle – which ultimately improves fuel economy and reduces carbon emissions.

The Author

Stefan Bruder, President EMEA, Texas Instruments,
© Bild: Texas Instuments

Stefan Bruder, President Texas Instruments Europe, Middle-East, Africa and India.

Stefan Bruder

was appointed as President of Texas Instruments in Europe, Middle-East, Africa and India with responsibilities for Sales, Operations, HR and Governmental Relations in August 2018.

Prior to this role he was Sales Area Director of the customer base in Germany, Austria, Switzerland and the Benelux countries. Stefan joined TI 15 years ago and held various positions as Field Application Engineer, Business Development Manager and spent two years in China to support Multi-National Corporations.

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