Efficient SiC automotive solutions
Infineon and Schweizer cooperate in chip embedding
Infineon and Schweizer Electronic want to jointly increase the efficiency of silicon carbide chips. To this end, they are developing an approach to embed 1200 V CoolSiC chips from Infineon directly into printed circuit boards.
Higher efficiency is expected to increase the range of electric cars and reduce overall system costs in this way.
Both companies have already demonstrated the potential of the new approach: They were able to embed a 48 V MOSFET in a printed circuit board. This resulted in a 35 percent increase in performance. Schweizer contributes to this success with its innovative p²-Pack solution, which enables the embedding of power semiconductors in PCBs.
Taking automotive power electronics to the next level
»Together, we are pursuing the goal of taking automotive power electronics to the next level,« says Robert Hermann, Product Line Head Automotive High-Voltage Discretes and Chips, from Infineon. »The low-inductance environment of a printed circuit board enables clean and fast switching. Combined with the excellent performance of 1200-V CoolSiC products, chip embedding enables highly integrated and efficient inverters that reduce overall system costs.«
»Infineon's 100 percent electrically tested standard cells (S-Cell) enable us to achieve high overall yields in the p²-pack manufacturing process,« explains Thomas Gottwald, Vice President Technology at Schweizer Electronic. »The fast-switching properties of the CoolSiC chips are best supported by the low-inductive interconnection that can be achieved with the p²-Pack. This leads to higher efficiency and improved reliability of power converters such as traction inverters, DC-DC converters or on-board chargers.«
Infineon and Schweizer at PCIM
Infineon and Schweizer will present the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg, Germany, at the Infineon booth 412 in Hall 7. Schweizer will also be on site at the show (Booth 410 in Hall 6).
