Texas Instruments is looking to break into a whole new market for its DLP technology: packaging production without the need for expensive masks.
Texas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company’s highest resolution direct imaging solution to date. With 8.9 million pixels, sub-micron resolution capabilities and a data rate of 110 gigapixels per second, the device eliminates the need for expensive mask technology while delivering the scalability, cost-effectiveness and precision needed for increasingly complex packaging.
Maskless digital lithography machines - which project light for projecting circuit designs on materials without a photomask or high-end stencil - are becoming increasingly popular for the manufacturing of advanced packaging.
With TI DLP technology, system assembly equipment manufacturers can leverage maskless digital lithography to achieve the high-resolution printing at scale necessary for advanced packaging. The new DLP991UUV acts as a programmable photomask, offering precise pixel control with reliable high-speed performance.
Improving advanced packaging requires lithography technology to be more cost-effective, scalable and precise. By eliminating mask infrastructure and its associated expenses, TI's DLP technology helps significantly reduce manufacturing costs while providing the flexibility to make real-time design adjustments without physical mask changes. The technology can achieve sub-micron precision on a substrate of any size, which directly translates to higher throughput, improved yield and fewer defects. These are significant advantages as advanced packaging manufacturers seek to meet escalating demands for high-bandwidth, low-power components in AI systems and 5G networks.
The DLP991UUV is the latest and leading device of TI's direct imaging portfolio. Key features of the device include:
Availability
Preproduction quantities of the new DLP991UUV DMD are available now.