C6C-RYZ2 by Tria Technologies
COM Express modules based on AMD Ryzen Embedded R2000
The new module family in COM Express Type 6 form factor by Tria Technologies is based on AMD Ryzen Embedded R2000 processors. The modules are ideal for automation, HMI systems and industrial image processing solutions. There are four variants available.
Tria Technologies offers a new COM Express family of modules based on AMD Ryzen Embedded R2000 processors. The boards are well suited for use in industrial applications. Standardized computer-on-modules (COMs) are ideal for the powerful electronics systems used by industrial applications. And a ready-to-use module provides high flexibility and open scalability. Depending on the requirements of the respective application, a broad selection of standard modules is available which comply with form factors such as COM Express and COM-HPC, SMARC or Qseven. Compute modules can optimize the time-to-market, while reducing project costs and design risks.
These embedded compute modules are ideal for robust applications, such as automation and HMI systems, and industrial image processing solutions. The boards can also be used in portable diagnostic equipment for medical applications. They can also be built in into measurement equipment, intelligent display control systems or powerful network analysis solutions. They are also suitable for professional video surveillance systems and complex digital signage solutions.
C6C-RYZ2 module family
The new »C6C-RYZ2« module family in COM Express Type 6 form factor integrates AMD Ryzen Embedded R2000 processors. This scalable module family combines high compute and graphics performance with low power features and cost effectiveness.
The versatile system-on-chip (SoC) technology of AMD Ryzen Embedded R2000 series offers high compute, graphics and interface functionality on one single die. The »Zen+« x86 core architecture combined with an AMD Radeon high-performance graphics unit provides a boost to the Ryzen Embedded mid-range portfolio.
The scalable C6C-RYZ2 modules build upon the previous generation C6C-RYZ based on AMD Ryzen Embedded Series V1000 / R1000. The connector pins and driver software of the system-on-chip (SoC) series are fully compatible. The new boards allow a performance upgrade in existing designs and offer additional functions.
As a seamless drop-in replacement for the previous generation board, development engineers and system architects can easily migrate their application to the new platform. The aim is to extend the flexibility of the system products and to expand the operational lifespan of the modules. Customers are hosted throughout the entire lifecycle of their products to safeguard their investments. The new module family adds at least four years to the application lifecycle.
To meet the requirements of different applications, the C6C-RYZ2 module family is equipped with quad- and dual-core processors. The Thermal Design Power (TDP) is scalable and ranges from 12W to 54W depending on the module variant. The low TDP supports the development of low-power applications in an efficient compact design at lower material costs. Four variants are available:
- AMD Ryzen Embedded R2544, quad-core processor (3.35/3.7 GHz, 8 GPU CU, 35-54W TDP)
- AMD Ryzen Embedded R2514, quad-core processor (2.1/3.7GHz, 8 GPU CU, 12-35W TDP)
- AMD Ryzen Embedded R2314, quad-core processor (2.1/3.5GHz, 6 GPU CU, 12-35W TDP)
- AMD Ryzen Embedded R2312, dual-core processor (2.7/3.5GHz, 3 GPU CU, 12-25W TDP)
The C6C-RYZ2 module family offers hardware-based security functions compliant to the requirements of Trusted Computing Group (TCG) and integrates a Trusted Platform Module (TPM) version 2.0.
The MSC C6C-RYZ2 modules are equipped with up to 32GByte fast dual-channel DDR4-3200 SDRAM with optional ECC (Error Correction Code) depending on the processor type. The compact board provides up to four independent display support, high level graphics acceleration and hardware-based video encoding/decoding.
In addition to the three DisplayPort, HDMI and DVI interfaces and one embedded DisplayPort / dual-channel LVDS interface, the COM Express Type 6 board provides up to four USB 3.2/2.0 and four USB 2.0 ports, up to eight PCI Express x1 lanes, and Gigabit Ethernet. Two SATA 6Gb/s interfaces allow the storage of data. The C6C-RYZ2 modules have dimensions of 95x95mm and are designed for the temperature range of 0 to +60°C.
