New System-on-Modules
Aries Embedded introduces SMARC-Modules
Aries Embedded introduces new System-on-Modules in SMARC form factor. The SoMs »MRZG2LS« and »MRZV2LS« are based on the architecture of the Renesas RZ family and offer high performance for embedded systems.
The »RZ/G2L« microprocessor from Renesas includes a dual Cortex-A55 (1.2 GHz) CPU, a 16-bit DDR3L/DDR4 interface, the Arm Mali-G31 3D graphics engine and a video codec (H.264). The »MRZG2LS« system-on-module (SoM) integrates the single/dual Cortex-A55/Cortex-M33 core, while the »MRZV2LS« uses a Cortex-A55 (1.2 GHz) CPU and an integrated AI accelerator. The new SoMs are suitable for applications such as entry-level industrial human-machine interfaces (HMIs), embedded vision or edge artificial intelligence (edge-AI).
With the two modules, Aries Embedded offers the first SoMs that comply with the SGET (Standardization Group for Embedded Technologies) SMARC 2.1 form factor.
Embedded systems with high performance
The new SoMs offer a diverse feature set around the single or dual Cortex-A55 core, with up to 1 GHz, and the Cortex-M33 core. In addition to the optional AI accelerator (DRP-AI on the MRZV2L), they feature a 3D graphics engine (Arm Mali-G31) and video codec (H.264). Memory options consist of 512 MB to 4 GB of DDR4 RAM, SPI NOR and 4 GB to 64 GB of eMMC NAND flash. The SoM are very flexible and versatile thanks to their wide variety of interfaces. These include dual 10/100/1000MBit Ethernet with PHY, USB2.0 host/OTG, 2x CAN, UART, I2C, SPI, ADC as well as a MIPI-CSI camera interface and a MIPI-DSI display interface. The temperature range covers 0 to +70 °C for commercial and -40 to +85 °C for industrial environments.
Evaluation kit for fast project start
Aries Embedded supports a fast and smooth entry into the new architecture with the corresponding evaluation kits »MRZG2LSEVK« and »MRZV2LSEVK«. With their function, they support developers in a quick project start, help with software development and also serve as a platform for rapid prototyping. The two modules will be available from the fourth quarter of 2023.
