3D automated optical, solder paste, and X-ray inspection and measurement From inspection to measurement

As part of the theme »From Inspection to Measurement« Saki demonstrates at productronica its new 3D automated optical inspection, solder paste, and x-ray technology and equipment.

»To truly capture all the potential problems and failures in circuit boards today, it requires a combination of the correct lighting, type of camera, camera angles, and the ability to not just inspect, but also to measure in true 3D,« explained Katsuhiro (Eddie) Ichiyama, general manager of Saki Europe, GmbH. “Other considerations are the ease of programming and whether you can do it off-line with a system that can simulate the machine or if you will have to factor in production down-time for programming. Our products, combined with over 20 years of expertise, can truly capture all the potential problems and failures in circuit boards today.«

Several new 3D automated in-line x-ray, solder paste, and optical inspection systems will be on display at productronica, including Saki's newest line of 3D in-line automated optical inspection systems. This 3D product line has a newly designed gantry, in 3 configurations and sizes, with a dual-lane model and a 3D scanning head with side camera option. Saki's AOI system doesn‘t just inspect, it provides measurements for components with a height range between 0 and 20mm and does it with 1-micron height resolution, a false call rate of less than 100 ppm with 0 escapes, and the fastest 3D AOI speed on the market with an average takt time of 18 seconds. It captures the most difficult defects, such as lifted leads, tombstones, reverses, and height variations.

Saki: productronica 2015, Hall A2, Booth 239