During the last year, the SMD package with ferrule guides has been adapted step by step after detailed simulations and tests in cooperation with the customers. The top part has been changed to a box shape, enabling an easy push in and pull out and a good holding force for the ferrules. It also gives more mechanical stability and makes the device easier to handle in automated production processes.
For the Through-Hole-Mount devices, Hamamatsu Photonics has developed and further improved a new, transparent resin, which enables reflow soldering and at the same time ensures a good optical performance and high reliability over lifetime. The resin which is unique in the market will soon be used for other optical semiconductors as well.