Nikon Metrology offers X-ray inspection systems specially tailored to the specific needs of various industries such as electronics, automotive and aerospace. Among the latest developments is an upgrade version of the XT V 160, a high-precision X-ray test system with flat detector that facilitates real-time imaging and detailed defect analysis. »Quality control of printed circuit board assembly (PCBA) today requires users to employ numerous measuring instruments, including X-ray inspection systems,« says Kamran Iqbal, Product Manager X-ray products at Nikon. »With increasing miniaturization and ever higher volumes, inspection is becoming more difficult. To be able to guarantee fault-free printed circuit boards, inspection systems must deliver the highest resolution, sharpness and measurement accuracy. We developed the XT V 160 with precisely these requirements in mind.«
The system comes with touchscreen or joystick control, and the sample manipulator enables easy and precise operation. With the real-time X-ray function, users can intuitively navigate thru complex printed circuits and electronic components and localize errors quickly. In automatic mode, objects are checked at a high thru-put rate. Another advantage is the design with an open X-ray tube (open-tube design). This means the user can exchange the filament, which generates the electron beam, locally and at a fraction of the costs incurred for closed X-ray tubes.
Real non-destructive testing
In conjunction with X.Tract, the latest test solution from Nikon, the XT V 160 allows real non-destructive testing, which is in no way inferior to computed tomography Iqbal is convinced. PCBA, components or wafers are positioned in an XT V 160 inspection system with X.Tract function. With accuracy in the submicron range 2D images of the printed circuit board area to be tested are then taken automatically from the 360 ° panoramic perspective. An up to 2400-fold magnification and object observation at an angle of up to 75° offer crystal clear images for quality testing. The 2D X-ray images are reconstructed to a detailed 3D model, which can be sliced and analyzed on each level.